HYPERLYNX TUTORIAL PDF

Probing at the pin: This places the Simulation probe at the pin and represents what you would see in a lab oscilloscope if you physically probed at the pin on the board. Probing at the die: This places the Simulation probe inside the die and represents what the die sees, which cannot be probed on the board. Defining Stackup The layer stackup for the PCB needs to be defined for the dielectric material, metal type, arrangement of signal and plane layers in a board among other items. Setting this up before running simulations helps to mimic the PCB, along with various characteristics such as trace impedance, trace separation and other parameters. There is an option to calculate the dielectric constant for the metal layer from surrounding dielectric layers. Z0 Planning: Define the characteristic impedance of the stackup.

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Probing at the pin: This places the Simulation probe at the pin and represents what you would see in a lab oscilloscope if you physically probed at the pin on the board. Probing at the die: This places the Simulation probe inside the die and represents what the die sees, which cannot be probed on the board.

Defining Stackup The layer stackup for the PCB needs to be defined for the dielectric material, metal type, arrangement of signal and plane layers in a board among other items. Setting this up before running simulations helps to mimic the PCB, along with various characteristics such as trace impedance, trace separation and other parameters. There is an option to calculate the dielectric constant for the metal layer from surrounding dielectric layers.

Z0 Planning: Define the characteristic impedance of the stackup. This planning tab is one of the most useful tabs as it enables you to calculate the optimal data when you need a specific target impedance for single and differential pair traces. Manufacturing: Define metal surface roughness and trace etch parameters. Custom View: Used to set up a customized view of the spreadsheet information derived from the other tabs and to tweak per user preference. Refer to the Hyperlynx User Guide for advanced details on these tabs.

There are various methods to set the impedance in the stackup editor, however we will use the Metal tab to quickly set the required impedances. This enables automatic characteristic impedance calculation by the tool based on the stackup. Select the Metal tab and set the Thickness of Dielectric as below. Note Z0 for the signal layers. Use the Z0 Planning Tab to check the required trace width and separation needed for a target impedance of a single trace and differential pair.

The Trace widths required to achieve these impedances are updated. The Trace widths required to achieve these impedances are shown.

The strategy for trace separation for differential can also be followed to meet the Target Z0, by choosing Solve for Separation. The strategy also includes an option to use both, i. Solve for width and Solve for Separation, and results shown in the Z0 Curve column.

Now that the stackup is created, it can be exported to be reused for future designs and simulations to save time.

Note: The stackup creation for a PCB design is one of the most important and critical steps during the design process and requires time and effort based on complexity. However, the steps described above are designed to give an insight into the editor and to provide a stackup for future designs and simulations in the series only. They are not based on any design parameters.

I will now leave you to use the steps we discussed above to familiarize yourself with the tool and interface. Tags 5.

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Sarisar Hyperlynx Tutorial Are you looking for? Mentor graphics reserves the right to make changes in specifications and other information contained in this publication without prior notice. Special benefits, such as the ability to save an unlimited number of private designs, are available for pads customers on maintenance. Gary lameris joined mentor graphics in as a technical marketing engineer for the mentor expedition pcb flow.

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